M I D E M   2 0 0 2  -  International Conference on Microelectronics, Devices and Materials
and the Workshop on Packaging and Interconnections in Electronics


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Final Program - Timetable

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MIDEM 2002 Conference Program (Final)

 

WEDNESDAY, OCTOBER 9

 

09:00  WELCOME AND OPENING CEREMONY

 

09:15   SESSION ON CERAMICS, METALS AND COMPOSITES

             CHAIRPERSON : M. Kosec

 

09:15   INVITED PAPER

             S. Valizadeh, L. Hultman

             Template Synthesis of One Dimensional Single and Multilayered Nanowires

10:00   B. Malic, D. Jenko, M. Starowicz, J. Bernard, M. Kosec

             Processing and Characterization of  (K,Na)NbO3 Based Piezoceramics

10:15   A. Moure, C. Alemany, D. Kuscer Hrovatin, L. Pardo, M. Kosec

             Microstructural and Piezoelectric Properties of (SrBi2Nb2O9)0. 35(Bi3TiNbO9)0. 65  Aurivillius-type

             Structure Ceramics from Mechanochemically Activated Precursors

 

10:30   COFFEE BREAK

 

10:45   SESSION ON CERAMICS, METALS AND COMPOSITES

             CHAIRPERSON : B. Malic

 

10:45   G. Drazic, S. Zupan, S. Kobe, P. McGuiness, J. Strazisar

             AEM Study of the Influence of High Magnetic Fields on Calcium Carbonate Nucleation and Crystallisation

11:00   J. Kovac, A. Vesel, A. Zalar

             Study of Interfacial Reactions Between Si Thin Film and GaN Substrate by Synchrotron Radiation

11:15   F. Koplan

             Automation of Production On-line Testing and Inspection of AlNiCo Magnets

11:30   M. Godec, M. Jenko, D. Mandrino, B. Sustarsic

             Nanocrystalline Fe-Si-B Powder Particles for Soft Magnetic Applications

11:45   M. Mandeljc, B. Malic, M. Kosec

             Influence of the Starting Compounds on the Crystallization and Electrical Properties of CSD PZT

             and PLZT Thin Films Prepared by Low-temperature Heat-treatment

12:00   S. Javoric, B. Malic, M. Kosec

             PZT Thin Films on La 0. 5 Sr 0. 5CoO3 Bottom Electrodes Prepared by Chemical Solution Deposition

12:15   U. Cvelbar, M. Mozetic, A. Zalar, D. Babic, I. Poberaj

             Surface Activation of a Polymer Foil by Oxygen Plasma

 

12:30   LUNCH

 

14:15   SESSION ON CERAMICS, METALS AND COMPOSITES

             CHAIRPERSON : S. Bernik

 

14:15   M. Mozetic, A. Zalar

             Discharge Cleaning of Silver Contacts

14:30   A. Bencan, M. Hrovat, J. Holc, G. Drazic, M. Kosec

             Structural and Electrical Characterization of PZT Films Fired on Nickel  Substrates

14:45   S. Bernik, A. Tavcar, S. Macek, M. Haris, M. Cergolj

             The Development of  Miniaturized ZnO-based Medium-voltage Energy Varistors

15:00   W. Mielcarek, K. Prociow

             ZNO Varistor Technology Modification with BaBiO2. 77

 

15:15   SESSION ON INTEGRATED CIRCUITS / CHAIRPERSON : J. Trontelj

 

15:15   A. Stern

             RFID Receiver Input Stage

15:30   S. Starasinic

             Dual Frequency Signal Decoder

15:45   A. Pletersek, R. Benkovic

             HVG - High Voltage Generation with Multistage Charge Pump

 

16:00   COFFEE BREAK

 

16:15   SESSION ON INTEGRATED CIRCUITS

             CHAIRPERSON : J. Trontelj

 

16:15   M. Finc, A. Trost, A. Zemva

             HW/SW Co-design and Implementation of Motion Detection Algorithms in an FPGA Device

16:30   A. Vodopivec

             Checking Modern Design Rules with Magic

16:45   D. Raic

             Supply Current and Switching Noise Scaling in Clock-skewed Systems

17:00   M. Verderber, A. Zemva

             HW/SW Partitioned Time Optimization of the MPEG2 Video Decoder in FPGA

17:15   J. Dedic, T. Zontar, A. Janhar, A. Trost

             Design and Implementation of Customized Embedded Platform

 

17:30  VISIT TO SYNCHROTRON ELETTRA IN BAZOVICA

 

20:00  WELCOME COCKTAIL - HOTEL KLUB

 



MIDEM 2002 Conference Program (Final)

 

THURSDAY, OCTOBER 10

 

09:00   WORKSHOP ON PACKAGING AND INTERCONNECTIONS IN ELECTRONICS

             CHAIRPERSON : D. Belavic

 

09:00   INVITED PAPER

             J. Ptak

             Business and Technology Challenges in Electronics Industry in the Early 21st Century

09:45   INVITED PAPER

             H. Quinones, A. Babiarz

             Flip Chip, CSP and WLP Technologies : A Reliability Perspective

 

10:30   COFFEE BREAK

 

10:45   WORKSHOP ON PACKAGING AND INTERCONNECTIONS IN ELECTRONICS

             CHAIRPERSON : D. Belavic

 

10:45   INVITED PAPER

             P. Svasta, V. Golumbeanu, C. Ionescu

             Electronic Passive Components Training Activity - Demand for Performance Electronic Package Development

11:30   INVITED PAPER

             J. Mueller, H. Griese, H. Reichl, Karl-Heinz Zuber

             Lead Free Interconnection Technology and the Environment

12:15   INVITED PAPER

             P. Collander

             Packaging and Interconnect for RF and Microwave

 

13:00  VISIT TO THE STUD FARM

 

13:30   LUNCH

 

15:45   WORKSHOP ON PACKAGING AND INTERCONNECTIONS IN ELECTRONICS

             CHAIRPERSON : D. Belavic

 

15:45   INVITED PAPER

             L. Golonka, A. Dziedzic, J. Kita, T. Zawada

             LTCC in Microsystems Application

16:30   INVITED PAPER

             M. Hrovat, D. Belavic, M. Pavlin, J. Holc

             Diffusion - Patterning; One of the Thick - film Interconnections Technologies

 

17:15   COFFEE BREAK

 

17:30   WORKSHOP ON PACKAGING AND INTERCONNECTIONS IN ELECTRONICS

             CHAIRPERSON : L. Golonka

 

17:30   K. Arshak, T.  O`Shea, D. Egan

             An Investigation Into the Use of a Polymer Film as an Alternative Material for Protecting Copper Terminals

             From Oxidation During the Electroplating Process

17:45   K. Bukat, J. Sitek

             Assessment of Lead -free Solder Pastes Wettability

18:00   H. Hackiewicz, G. Koziol, E. Malczynska-Paz

             Microvia Formation Problems

18:15   M. Hrovat, J. Holc, D. Belavic, J. Bernard

             Interactions Between Conductive Phase and Glass in Thick-film Resistors

18:30   V. Sedlakova, F. Melkes, J. Sikula, P. Dobis, D. Rocak, D. Belavic

             Influence of Contact Electrode on Thick film Resistors Noise and Non-linearity

18:45   A. Dziedzic, W. Mielcarek

             Varistors in LTCC Structures

19:00   M. Hrovat, J. Holc, S. Drnovsek, D. Belavic, J. Bernard, M. Kosec,   L. Golonka, A. Dziedzic, J. Kita

             PZT Thick Films on LTCC Substrates

 

20:00  CONFERENCE DINNER  - HOTEL KLUB

 



MIDEM 2002 Conference Program (Final)

 

FRIDAY, OCTOBER 11

 

09:00   SESSION ON SENSORS

             CHAIRPERSON : S. Amon

 

09:00   J. Trontelj, A. Pevec

             Outband Calibration of Magnetic Microsystems

09:15   D. Strle

             Design Considerations for Integrated Low-noise Light Intensity Measurement System

09:30   M. Mozek, Z. Chobola, U. Aljancic, D. Vrtacnik, D. Resnik, S. Amon

             Noise Sources in JFET PTAT Structure

09:45   U. Aljancic, D. Resnik, D. Vrtacnik, M. Mozek, S. Amon

             Temperature Drift of Piezoresistive Pressure Sensor Offset Voltage

10:00   G. M. Bilei, F. Moscatelli, D. Passeri, G. U. Pignatel, A. Santocchia, G. Hall, B. MacEvoy

             Defects Modeling of Heavily Irradiated Silicon Detectors

10:15   D. Vrtacnik, D. Resnik, U. Aljancic, M. Mozek S. Amon

             Characterization of Strip Capacitances in Silicon Microstrip Detector

10:30   M. Santo Zarnik, D. Rocak, S. Macek

             An Analysis of the Residual Stresses in a Silicon Piezoresistive Pressure-sensor Die Induced bye

             Adhesive Material During Curing

10:45   D. Belavic, M. Hrovat, A. Bencan, J. Bernard, J. Cilensek, W. Smetana, H. Homolka,

             R. Reicher, L. Golonka, A. Dziedzic, J. Kita

             Thick-film Resistors as Sensing Elements on Various Substrates

 

11:00   COFFEE BREAK

 

11:15   SESSION ON OPTOELECTRONICS

             CHAIRPERSON : M. Topic

 

11:15   E. Bunte, V. Mandryka, H. -J. Büchner, G. Jäger, H. Stiebig,

             A New Concept for Position Detectors Based on Sampling a Standing Wave

11:30   J. Krc, H. Stiebig, M. Vukadinovic, F. Smole, M. Topic

             Modelling of Dynamical Properties of a-Si:H p-i-n Photodetector

11:45   M. Vukadinovic, FranciscoA. Rubinelli, F. Smole, M. Topic

             ASPIN and D-AMPS in Parellel - Comparison of Tunnelling Models on mc-Si and a-Si Junctions

12:00   M. Jankovec, F. Smole, M. Topic

             Automated Solar Cell Characterisation System

12:15   A. Suhadolnik, J. Petrisic

             Rough Core Surface Optical Fiber Displacement Sensor

 

12:30   SESSION ON DEVICE PHYSICS AND MODELLING

             CHAIRPERSON : B. Cvikl

 

12:30   U. Merc, F. Smole, M. Topic

             Energy Levels in Double and Triple Barrier Structures in the Presence of an

             Electric Field and Formation of Superlattice Minibands

12:45   B. Cvikl, D. Korosak

             The I-U and C-U Barrier Heights of Non-ideal Schottky Junctions

13:00   D. Korosak, B. Cvikl

             Interface Charge in Non-ideal Metal -semiconductor Structures

13:15   D. Resnik, D. Vrtacnik, U. Aljancic, M. Mozek, S. Amon

             Aluminum as a Protective Mask in Anisotropic Wet Etching of Silicon

13:30   A. Pirih, A. Pregelj, V. Murko, Z. Hribar, A. Stagoj

             Development of Electric Measurements for Gas Arrester Characterization

 

13:45  CLOSING OF THE CONFERENCE


Complete Program (Final) is also available as
Adobe Acrobat PDF File (63kb) or Microsoft Word File (64kb)

Final Program - Timetable

Back to the Final Program Main Page


MIDEM Conference 2002 homepage is edited by the Laboratory of Semiconductor Devices,
Faculty of Electrical Engineering University of Ljubljana