M I D E M 2 0 12 - International Conference on
Microelectronics, Devices and Materials
and the Workshop on
Ceramic Microsystems
INVITED SPEAKER OF THE CONFERENCE
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Paul Muralt, Ceramics Laboratory, École Polytechnique Fédérale de Lausanne (EPFL), CH-1015 Lausanne, Switzerland
Energy Harvesting with Piezoelectric Thin Film Micro Devices: Status and Promises
INVITED SPEAKERS
OF THE WORKSHOP
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Leszek J. Golonka, Faculty of Microsystem Electronics and Photonics, Wroclaw University of Technology, Wybrzeze Wyspianskiego 27, 50-370 Wroclaw, Poland
LTCC fluidic microsystems
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Thomas Maeder, Laboratoire de Production Microtechnique (LPM), École Polytechnique Fédérale de Lausanne (EPFL), CH-1015 Lausanne, Switzerland
3D structuration of LTCC and related technologies for thermal management and microfluidic structures
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W. Kinzy Jones, Department of Mechanical and Materials Engineering, Florida International University, Miami, FL 33199, USA
Cofired Platinum/Alumina Microsystems for Implantable Medical Applications
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Raul Bermejo, Montanuniversität Leoben, Institut für Struktur- und Funktionskeramik, Leoben, Austria
Mechanical properties of Low Temperature Co-fired Ceramics: testing methodologies for strength characterization
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Uwe Partsch, Fraunhofer Institute for Ceramic Technologies and Systems, Winterbergstrasse 28, D-01277 Dresden, Germany
LTCC-based sensors for mechanical quantities
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Goran Radosavljević , Department of Applied Electronics Materials, Institute of Sensor and Actuators Systems, Vienna University of Technology, Gusshausstrasse 27-29, A-1040 Vienna, Austria;
Resonant sensors realized in LTCC-technology for wireless monitoring of physical parameters
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Franz Bechtold, VIA electronic GmbH, Robert-Friese-Strasse 3, D-07629 Hermsdorf, Germany;
Innovation steps towards a novel and cost efficient LTCC packaging technology for high end applications
MIDEM Conference homepage is edited by the
Laboratory of Photovoltaics and Optoelectronics,
Faculty of Electrical Engineering,
University of Ljubljana