M I D E M 2 0 1 2 - International Conference on Microelectronics, Devices and Materials
and the Workshop on Ceramic Microsystems

WORKSHOP

Each year, beginning in 1998, workshops dedicated to a special topic are included to the programme of the MIDEM Conferences. During the workshop, invited speakers present papers on the chosen topics from different aspects within their special field, thus offering the audience valuable information. Time for thorough discussions is provided between invited presentations. Attendance at the workshop is included in the Conference registration fee.

For the year 2012, we are pleased to announce a

Workshop on Ceramic Microsystems

Programme:

1 Leszek J. Golonka Faculty of Microsystem Electronics and Photonics, Wroclaw University of Technology, Wybrzeze Wyspianskiego 27, 50-370 Wroclaw, Poland LTCC fluidic microsystems

2 Thomas Maeder Laboratoire de Production Microtechnique (LPM), École Polytechnique Fédérale de Lausanne (EPFL), CH-1015 Lausanne, Switzerland 3D structuration of LTCC and related technologies for thermal management and microfluidic structures

3 W. Kinzy Jones Department of Mechanical and Materials Engineering, Florida International University, Miami, FL 33199, USA Cofired Platinum/Alumina Microsystems for Implantable Medical Applications

4 Raul Bermejo Montanuniversität Leoben, Institut für Struktur- und Funktionskeramik, Leoben, Austria Mechanical properties of Low Temperature Co-fired Ceramics: testing methodologies for strength characterization

5 Uwe Partsch Fraunhofer Institute for Ceramic Technologies and Systems, Winterbergstrasse 28, D-01277 Dresden, Germany LTCC-based sensors for mechanical quantities

6 Goran Radosavljević Department of Applied Electronics Materials, Institute of Sensor and Actuators Systems, Vienna University of Technology, Gusshausstrasse 27-29, A-1040 Vienna, Austria Resonant sensors realized in LTCC-technology for wireless monitoring of physical parameters

7 Franz Bechtold VIA electronic GmbH, Robert-Friese-Strasse 3, D-07629 Hermsdorf, Germany; Innovation steps towards a novel and cost efficient LTCC packaging technology for high end applications

MIDEM Conference 2011 homepage is edited by the Laboratory of Photovoltaics and Optoelectronics, Faculty of Electrical Engineering, University of Ljubljana

1	Leszek J. Golonka	Faculty of Microsystem Electronics and Photonics, Wroclaw University of Technology, Wybrzeze Wyspianskiego 27, 50-370 Wroclaw, Poland	LTCC fluidic microsystems
2	Thomas Maeder	Laboratoire de Production Microtechnique (LPM), École Polytechnique Fédérale de Lausanne (EPFL), CH-1015 Lausanne, Switzerland	3D structuration of LTCC and related technologies for thermal management and microfluidic structures
3	W. Kinzy Jones	Department of Mechanical and Materials Engineering, Florida International University, Miami, FL 33199, USA	Cofired Platinum/Alumina Microsystems for Implantable Medical Applications
4	Raul Bermejo	Montanuniversität Leoben, Institut für Struktur- und Funktionskeramik, Leoben, Austria	Mechanical properties of Low Temperature Co-fired Ceramics: testing methodologies for strength characterization
5	Uwe Partsch	Fraunhofer Institute for Ceramic Technologies and Systems, Winterbergstrasse 28, D-01277 Dresden, Germany	LTCC-based sensors for mechanical quantities
6	Goran Radosavljević	Department of Applied Electronics Materials, Institute of Sensor and Actuators Systems, Vienna University of Technology, Gusshausstrasse 27-29, A-1040 Vienna, Austria	Resonant sensors realized in LTCC-technology for wireless monitoring of physical parameters
7	Franz Bechtold	VIA electronic GmbH, Robert-Friese-Strasse 3, D-07629 Hermsdorf, Germany;	Innovation steps towards a novel and cost efficient LTCC packaging technology for high end applications