M I D E M    2 0 2 4

59th International Conference

on Microelectronics, Devices and Materials

with the Workshop on

Electromagnetic Compatibility: From Theory to Practice

Conference 2011 Logo
CONFERENCE 2024
Announcement and Call for Papers

October 2nd - 4th, 2024

Rimske Toplice, Slovenia

Rimske terme, Terme resort d.o.o., Toplice 10, 3272 Rimske Toplice

 

  University of Ljubljana Logo University of Ljubljana, Faculty of Electrical Engineering   IJS Institut "Jožef Stefan"  
  Elektrotehniska Zveza Slovenije Logo Elektrotehniška
zveza Slovenije
IMAPS Logo Slovenia
Chapter
IEEE Logo Slovenia
Section
 
  Slovenian Research Agency Logo  

ORGANIZER

MIDEM - Society for Microelectronics, Electronic Components and Materials
Stegne 7, 1521 Ljubljana, Slovenia



SPONSORS

Infineon Logo   Keko Logo       Keko Logo    Keko Logo    Keko Logo

PARTNERS

University of Ljubljana, Faculty of Electrical Engineering, Ljubljana, Slovenia
Institute "Jožef Stefan" , Ljubljana, Slovenia
IMAPS - Slovenia Chapter
IEEE - Slovenia Chapter
Mikroiks d.o.o., Ljubljana, Slovenia


CONFERENCE PROCEEDINGS

Invited and contributed papers will be published in the Conference e-Proceedings.


LANGUAGE

The official conference language is English.


MIDEM Conference homepage is edited by the   Laboratory of Photovoltaics and Optoelectronics,   Faculty of Electrical Engineering,   University of Ljubljana