MIDEM 2026
61st International Conference on Microelectronics, Devices and Materials
- 28th - 30th September, 2026
- Faculty of Electrical Engineering, Ljubljana
MIDEM Conference
General Information
The 61st International Conference on MIcroelectronics, DEvices and Materials – MIDEM 2026 continues the long-standing tradition of annual international conferences organized by the MIDEM Society. For decades, the conference has brought together leading Slovenian and international experts in the fields of microelectronics and materials research and innovation.
Covering a broad field of topics MIDEM 2026 will feature around 60 presentations across five thematic sessions over three days. The intensive program will offer scientists and engineers an opportunity to showcase their latest work, exchange ideas, and discuss emerging trends and challenges with a global audience.
Recognized throughout the electronics community, MIDEM conference has previously welcomed hundreds of distinguished researchers from around the world. Its core mission remains unchanged: to foster collaboration, strengthen professional networks, and build lasting partnerships and friendships among participants from academia and industry.
Sponsors
MIDEM Workshop
Workshop
Each year, beginning in 1998, workshops dedicated to a special topic are included to the programme of the MIDEM Conferences. During the workshop, invited speakers present papers on the chosen topics from different aspects within their special field, thus offering the audience valuable information. Time for thorough discussions is provided between invited presentations. Attendance at the workshop is included in the Conference registration fee.
For the year 2026, we are pleased to announce a Workshop on Integrated Photonics
Partners
Call for Papers
Original papers related (but not limited) to the following areas are invited for submission:
- Integrated photonic circuits, devices and systems (WS),
- Chips and semiconductor technologies,
- Sensors and actuators,
- Electromechanical devices and micro/nanosystems,
- Electronics, electromagnetic compatibility,
- Nanoelectronics, quantum chips and devices,
- Optoelectronics and photonics,
- Photovoltaic materials, devices and systems,
- Electronic materials science, technology and applications,
- Thick and thin film technologies,
- Education in microelectronics, devices and materials,
- Student projects.
Abstract & Paper Instructions
- Abstract - Instructions and Template for Authors, MIDEM_Abstract_Template.docx
- Paper - Instructions and Template for Authors, MIDEM_Paper_Template.docx
Please submit your abstract and/or paper using the web form provided below. Ensure that the files are in PDF or MSWord format and named according to the following convention: “SurnameOfTheFirstAuthor_MIDEM_year.pdf”.
Paper Submission Form
Paper submission form
Important Dates
- Extended abstract deadline: May 15
- Notification of acceptance: June 30
- Deadline for final version of manuscript: September 1
- Registration and payment of registration fee deadline: September
Accomodation
- The Conference will take place at Faculty of Electrical Engineering, Ljubljana
- Accomodation is available in Ljubljana hotels.
- WWW: https://www.ljubljana.info/hotels/
English 
Slovenian