M I D E M   2 0 0 2  -  International Conference on Microelectronics, Devices and Materials
and the Workshop on Packaging and Interconnections in Electronics

Invited Speakers

The programme committee is pleased to announce the following invited speakers, who will give their presentations on the following subjects :

The Workshop on Packaging and Interconnections in Electronics:

  • Janusz Ptak,
    Hybrid Microelectronics Specialist, Angerville, France
    Business and Technology Chalanges in Electronics Industry in the Early 21st Century

  • Paul Svasta, Virgil Golumbeanu, Ciprian Ionescu,
    Department of Electronic Technology and Reliability, Center for Technological Electronics and Interconnection Techniques, Politehnica University of Bucharest, Romania
    Electronic Passive Components Training Activity -
    Demand for Performance Electronic Package Development

  • Jutta Mueller, Hansjoerg Griese, Herbert Reichl*, K.-H. Zuber*,
    Fraunhofer Institut für Zuverlässigkeit und Mikrointegration, Berlin, Germany
    *Technical University of Berlin, Berlin, Germany
    Lead-free Interconnection Technology and the Environment

  • Paul Collander,
    Nokia Networks, Espoo, Finland
    Packaging and Interconnect for RF and Microwave

  • Leszek J. Golonka, Andrzej Dziedzic, Jaroslav Kita, Tomasz Zawada,
    Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Wroclaw, Poland
    LTCC in Microsystems Applications

  • Marko Hrovat, Darko Belavic*, Marko Pavlin*, Janez Holc,
    Jo˛ef Stefan Institute, Ljubljana, Slovenia
    * HIPOT-R&D, Sentjernej, Slovenia
    Diffusion-patterning: One of the Thick-film Interconnections Technologies

  • Horatio Quinones,
    Asymtek Headquarters, Carlsbad, CA, USA
    (Fundamentals on electronic packages; jetting technologies for advanced packages)

  • S. Valizadeh, L. Hultman*,
    ACREO AB, Norrköping, Sweden
    *Thin Film Physics Division, Department of Physics, Linköping University, Linköping, Sweden
    Template Synthesis of One Dimensional Single and Multilayered Nanowires

    • For the Abstracts listed in the Workshop section please click one of the above links (click the corresponding Abstract title)
    or go to the Workshop main page.

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